NVIDIA purchased $3.5 billion worth of convertible bonds issued by MediaTek, marking its first major investment in a Taiwanese company [1, 2, 3]. The bonds represent about 90% of MediaTek's total $3.9 billion overseas convertible bond issuance, the largest in Taiwan's capital market history [3, 4, 5].

The bonds have a five-year term with a 0% coupon rate, and will be listed on the Singapore Exchange on September 8, 2026 [5, 6]. The conversion price is NT$4513.75 per share, a 15% premium to the market closing price at bond pricing, and full conversion would dilute existing shares by approximately 1.67% [5, 6].

MediaTek and NVIDIA announced they will expand cooperation in three AI technology domains: AI infrastructure, edge AI computing, and automotive AI products [3, 4, 5]. MediaTek will use NVIDIA’s NVLink Fusion platform to help hyperscalers, cloud service providers, and AI developers build customized XPUs and rack-scale AI systems [1, 3, 4, 5].

The two companies will co-develop future generations of RTX Spark and DGX Spark chips integrating NVIDIA GPUs into consumer PCs, supercomputers, and workstations [3, 7, 8]. They also plan to collaborate on AI-enabled automotive platforms using MediaTek's Dimensity Auto platform paired with NVIDIA DRIVE AGX technology [3, 8, 6].

NVIDIA CEO Jensen Huang said, "AI is redefining computing platforms from large AI factories to personal computers and cars" and highlighted their joint work on platforms "to extend NVIDIA accelerated computing technology to more new markets, enabling customers to build differentiated AI systems at scale" [7, 9].

MediaTek Vice Chairman and CEO Cai Lixing stated that NVIDIA's investment "strengthens our cooperation on cloud AI infrastructure, edge AI computing, and automotive AI platforms," and expressed confidence in combining NVIDIA’s leadership in accelerated computing with MediaTek's AI technology spanning edge to cloud [9].

MediaTek will leverage NVIDIA’s prebuilt, system-prevalidated NVLink Fusion multi-die XPU architecture to accelerate co-development from chips to rack-scale AI systems [3, 4, 5].

MediaTek's board approved the $3.9 billion convertible bond issuance plan on July 31, 2026 [3]. The detailed investment and AI collaboration were announced on August 31, 2026 [1, 6]. The bond listing on the Singapore Exchange is set for September 8, 2026 [5, 6].